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Tuesday, April 16, 2024

The Google Pixel 8 might run cooler and extra environment friendly, due to Tensor G3

What it’s good to know

  • Rumors recommend Google’s Tensor G3 chip may function a FO-WLP packaging methodology out of Samsung’s Foundry.
  • The strategy is alleged to encourage energy effectivity whereas additionally lowering warmth era for the Pixel telephones.
  • Google’s Tensor chip hasn’t had the very best fame, and the corporate is reportedly seeking to transfer to TSMC for the Tensor G4 earlier than subsequent 12 months’s Pixel.

There may be a bit of extra in retailer for Google’s upcoming third-generation chip inside its subsequent smartphone launch.

Rumored by Tech_Reve on X, Google’s personal Tensor G3 chip would possibly function FO-WLP packaging, one of many first to take action out of Samsung’s Foundry (through 9to5Google). The brand new methodology, which stands for “Fan-out Wafer-level,” would encourage energy effectivity and cut back warmth generated from the gadget.

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