What it’s good to know
- Rumors recommend Google’s Tensor G3 chip may function a FO-WLP packaging methodology out of Samsung’s Foundry.
- The strategy is alleged to encourage energy effectivity whereas additionally lowering warmth era for the Pixel telephones.
- Google’s Tensor chip hasn’t had the very best fame, and the corporate is reportedly seeking to transfer to TSMC for the Tensor G4 earlier than subsequent 12 months’s Pixel.
There may be a bit of extra in retailer for Google’s upcoming third-generation chip inside its subsequent smartphone launch.
Rumored by Tech_Reve on X, Google’s personal Tensor G3 chip would possibly function FO-WLP packaging, one of many first to take action out of Samsung’s Foundry (through 9to5Google). The brand new methodology, which stands for “Fan-out Wafer-level,” would encourage energy effectivity and cut back warmth generated from the gadget.
It was beforehand anticipated that Google would proceed to depend on Samsung to craft the semi-custom chips. Nonetheless, sure points nonetheless stay unsure. That mentioned, a change to the Tensor G3’s core structure is anticipated as Google tries to work some extra energy into the chip.
Moreover, there was hypothesis that the corporate would proceed to function the identical modem because the Tensor G2 within the upcoming iteration.
The Tensor G3 is the primary amongst Samsung Foundry’s smartphone chips to include FO-WLP packaging, which is anticipated to scale back warmth era and improve energy effectivity for the Tensor G3.September 11, 2023
Google’s personal chip has had its (many) faults since its debut, starting from effectivity issues to overheating. Most notable is the slight rework given to the Tensor G2 chip for the Pixel 7a, the place Google determined to change up the packaging methodology for the chip in its most up-to-date finances telephone, making the gadget run severely hotter and slower.
There’s a chance that these issues will go away — or, at the least, not be such an issue sooner or later. Rumors in July instructed Google might presumably drop Samsung for its Tensor G4 chip, which might seemingly energy the Pixel 9 sequence. Google would go from counting on Samsung Semiconductors to piggybacking off TSMC.
A change like this may tremendously profit the corporate’s satisfactory Tensor chip, as Qualcomm’s shift to TSMC was like evening and day when evaluating the Snapdragon 8 Gen 1 and Snapdragon 8+ Gen 1. Google additionally has plans to completely produce its Tensor chip in-house by 2025.
We’ve three weeks till Google reveals the Pixel 8 sequence throughout its fall occasion on October 4. The wait’s not lengthy now till we see how these modifications to the Tensor G3 impression the following Pixel sequence.
